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74AHC157BQ,115 vs MC74HC157AD feature comparison

74AHC157BQ,115 NXP Semiconductors

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MC74HC157AD Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code QFN
Package Description 2.50 X 3.50 MM, 0.85 MM HEIGHT, MO-241, SOT763-1, DHVQFN-16 PLASTIC, SOIC-16
Pin Count 16
Manufacturer Package Code SOT763-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC/H/U/V HC/UH
JESD-30 Code R-PQCC-N16 R-PDSO-G16
JESD-609 Code e4 e0
Length 3.5 mm 9.9 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 21.5 ns 33 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 2.5 mm 3.9 mm
Base Number Matches 2 4
Load Capacitance (CL) 50 pF
Max I(ol) 0.006 A
Package Equivalence Code SOP16,.25
Prop. Delay@Nom-Sup 32 ns
Logic » Multiplexer/Demultiplexers
Logic » Multiplexer/Demultiplexers

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