74ACTQ827SDCQR
vs
N74F827N,602
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP,
|
DIP, DIP24,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
ACT
|
F/FAST
|
| JESD-30 Code |
R-GDIP-T24
|
R-PDIP-T24
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
9 ns
|
14 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.715 mm
|
4.7 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
24
|
| Additional Feature |
|
WITH DUAL OUTPUT ENABLE
|
| Control Type |
|
ENABLE LOW
|
| Length |
|
31.7 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.064 A
|
| Package Equivalence Code |
|
DIP24,.3
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Power Supply Current-Max (ICC) |
|
100 mA
|
| Prop. Delay@Nom-Sup |
|
18 ns
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare 74ACTQ827SDCQR with alternatives
Compare N74F827N,602 with alternatives