72V73273BBG
vs
IDT72V73263DRG8
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
PBGA
|
QFP
|
Package Description |
17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-208
|
28 X 28 MM, 0.50 MM PITCH, PLASTIC, QFP-208
|
Pin Count |
208
|
208
|
Manufacturer Package Code |
BBG208
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B208
|
S-PQFP-G208
|
JESD-609 Code |
e1
|
e3
|
Length |
17 mm
|
28 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
208
|
208
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
FQFP
|
Package Equivalence Code |
BGA208,16X16,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
FLATPACK, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.97 mm
|
4.1 mm
|
Supply Current-Max |
0.38 mA
|
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
DIGITAL TIME SWITCH
|
DIGITAL TIME SWITCH
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Matte Tin (Sn)
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
1 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
17 mm
|
28 mm
|
Base Number Matches |
2
|
1
|
|
|
|
Compare 72V73273BBG with alternatives
Compare IDT72V73263DRG8 with alternatives