72V263L6PFG8
vs
72V263L6BC
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
End Of Life
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
GREEN, PLASTIC, TQFP-80
|
11 X 11 MM, 1 MM PITCH, BGA-100
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Access Time-Max |
4 ns
|
4 ns
|
| Additional Feature |
IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
|
IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
|
| Cycle Time |
6 ns
|
6 ns
|
| JESD-30 Code |
S-PQFP-G80
|
S-PBGA-B100
|
| Length |
14 mm
|
11 mm
|
| Memory Density |
147456 bit
|
147456 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
80
|
100
|
| Number of Words |
8192 words
|
8192 words
|
| Number of Words Code |
8000
|
8000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
8KX18
|
8KX18
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
225
|
| Seated Height-Max |
1.6 mm
|
1.5 mm
|
| Supply Current-Max |
0.03 mA
|
0.035 mA
|
| Supply Voltage-Max (Vsup) |
3.45 V
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
3.15 V
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
14 mm
|
11 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
CABGA
|
| Pin Count |
|
100
|
| Manufacturer Package Code |
|
BC100
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Date Of Intro |
|
1998-11-01
|
| Alternate Memory Width |
|
9
|
| Clock Frequency-Max (fCLK) |
|
166 MHz
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Package Equivalence Code |
|
BGA100,10X10,40
|
| Qualification Status |
|
Not Qualified
|
| Standby Current-Max |
|
0.015 A
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 72V263L6PFG8 with alternatives
Compare 72V263L6BC with alternatives