There are no models available for this part yet.
Overview of 72V263L6BC by Integrated Device Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for 72V263L6BC by Integrated Device Technology Inc
Part Data Attributes for 72V263L6BC by Integrated Device Technology Inc
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|---|---|
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Pbfree Code
|
No
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Rohs Code
|
No
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Part Life Cycle Code
|
Transferred
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Ihs Manufacturer
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INTEGRATED DEVICE TECHNOLOGY INC
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Part Package Code
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CABGA
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Package Description
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11 X 11 MM, 1 MM PITCH, BGA-100
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Pin Count
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100
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Manufacturer Package Code
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BC100
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Reach Compliance Code
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not_compliant
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.71
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Date Of Intro
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1998-11-01
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Access Time-Max
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4 ns
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Additional Feature
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IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
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Alternate Memory Width
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9
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Clock Frequency-Max (fCLK)
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166 MHz
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Cycle Time
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6 ns
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JESD-30 Code
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S-PBGA-B100
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JESD-609 Code
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e0
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Length
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11 mm
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Memory Density
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147456 bit
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Memory IC Type
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OTHER FIFO
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Memory Width
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18
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Moisture Sensitivity Level
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3
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Number of Functions
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1
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Number of Terminals
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100
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Number of Words
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8192 words
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Number of Words Code
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8000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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8KX18
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Output Enable
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YES
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LBGA
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Package Equivalence Code
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BGA100,10X10,40
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, LOW PROFILE
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Parallel/Serial
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PARALLEL
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Peak Reflow Temperature (Cel)
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225
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Qualification Status
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Not Qualified
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Seated Height-Max
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1.5 mm
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Standby Current-Max
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0.015 A
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Supply Current-Max
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0.035 mA
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Supply Voltage-Max (Vsup)
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3.45 V
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Supply Voltage-Min (Vsup)
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3.15 V
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Supply Voltage-Nom (Vsup)
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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TIN LEAD
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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30
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Width
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11 mm
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Alternate Parts for 72V263L6BC
This table gives cross-reference parts and alternative options found for 72V263L6BC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 72V263L6BC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 72V263L6BC | 8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V, CABGA168/Tray | Renesas Electronics Corporation | 72V263L6BC vs 72V263L6BC |
| IDT72V263L6BC | FIFO, 8KX18, 4ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, BGA-100 | Integrated Device Technology Inc | 72V263L6BC vs IDT72V263L6BC |
| 72V263L6BCG8 | 8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V, CABGA0/Reel | Renesas Electronics Corporation | 72V263L6BC vs 72V263L6BCG8 |
| 72V263L6BCG8 | CABGA-100, Reel | Integrated Device Technology Inc | 72V263L6BC vs 72V263L6BCG8 |
| 72V263L6BCG | 8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V, CABGA168/Tray | Renesas Electronics Corporation | 72V263L6BC vs 72V263L6BCG |
| IDT72V263L6BCG | FIFO, 8KX18, 4ns, Synchronous, CMOS, PBGA100, 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100 | Integrated Device Technology Inc | 72V263L6BC vs IDT72V263L6BCG |