72V263L6PFG8 vs 72V263L6BCG8 feature comparison

72V263L6PFG8 Integrated Device Technology Inc

Buy Now Datasheet

72V263L6BCG8 Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description GREEN, PLASTIC, TQFP-80 11 X 11 MM, 1 MM PITCH, GREEN, BGA-100
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 4 ns 4 ns
Additional Feature IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
Cycle Time 6 ns 6 ns
JESD-30 Code S-PQFP-G80 S-PBGA-B100
Length 14 mm 11 mm
Memory Density 147456 bit 147456 bit
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 80 100
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8KX18 8KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LBGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 1.6 mm 1.5 mm
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 11 mm
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code CABGA
Pin Count 100
Manufacturer Package Code BCG100
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

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