72V261LA15PFG8 vs 72V261LA15PFGI feature comparison

72V261LA15PFG8 Integrated Device Technology Inc

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72V261LA15PFGI Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description TQFP-64 LQFP, QFP64,.66SQ,32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 10 ns 10 ns
Additional Feature RETRANSMIT RETRANSMIT
Cycle Time 15 ns 15 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
Length 14 mm 14 mm
Memory Density 147456 bit 147456 bit
Memory Width 9 9
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 16KX9 16KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 1 1
Pbfree Code Yes
Part Package Code QFP
Pin Count 64
Clock Frequency-Max (fCLK) 66.7 MHz
JESD-609 Code e3
Memory IC Type OTHER FIFO
Moisture Sensitivity Level 3
Package Equivalence Code QFP64,.66SQ,32
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Standby Current-Max 0.02 A
Supply Current-Max 0.055 mA
Terminal Finish Matte Tin (Sn) - annealed
Time@Peak Reflow Temperature-Max (s) 30

Compare 72V261LA15PFG8 with alternatives

Compare 72V261LA15PFGI with alternatives