72V261LA15PFG8
vs
72V261L15PF
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
TQFP-64
QFP, QFP64,.66SQ,32
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
10 ns
10 ns
Additional Feature
RETRANSMIT
Cycle Time
15 ns
JESD-30 Code
S-PQFP-G64
S-PQFP-G64
Length
14 mm
Memory Density
147456 bit
147456 bit
Memory Width
9
9
Number of Functions
1
Number of Terminals
64
64
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16KX9
16KX9
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK
Parallel/Serial
PARALLEL
Seated Height-Max
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
14 mm
Base Number Matches
1
1
Pbfree Code
Clock Frequency-Max (fCLK)
66.7 MHz
JESD-609 Code
e0
Memory IC Type
OTHER FIFO
Moisture Sensitivity Level
3
Package Equivalence Code
QFP64,.66SQ,32
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Standby Current-Max
0.015 A
Supply Current-Max
0.15 mA
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
30
Compare 72V261LA15PFG8 with alternatives
Compare 72V261L15PF with alternatives