72V251L15JG vs IDT72V251L15JGI8 feature comparison

72V251L15JG Renesas Electronics Corporation

Buy Now Datasheet

IDT72V251L15JGI8 Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code compliant compliant
Access Time-Max 10 ns 10 ns
Clock Frequency-Max (fCLK) 66.7 MHz
Cycle Time 15 ns 15 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e3 e3
Length 13.9954 mm 13.9954 mm
Memory Density 73728 bit 73728 bit
Memory IC Type OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 8KX9 8KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 3.55 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) - annealed MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 11.4554 mm 11.4554 mm
Base Number Matches 4 1
Pbfree Code Yes
Part Package Code QFJ
Package Description QCCJ,
Pin Count 32
ECCN Code EAR99
HTS Code 8542.32.00.71

Compare 72V251L15JG with alternatives

Compare IDT72V251L15JGI8 with alternatives