72V251L10PFG8
vs
IDT72V251L10J8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
QFJ
Package Description
TQFP-32
PLASTIC, LCC-32
Pin Count
32
32
Manufacturer Package Code
PRG32
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Date Of Intro
1992-01-01
Access Time-Max
6.5 ns
6.5 ns
Clock Frequency-Max (fCLK)
100 MHz
100 MHz
Cycle Time
10 ns
10 ns
JESD-30 Code
S-PQFP-G32
R-PQCC-J32
JESD-609 Code
e3
e0
Length
7 mm
13.9954 mm
Memory Density
73728 bit
73728 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8KX9
8KX9
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
QCCJ
Package Equivalence Code
QFP32,.35SQ,32
LDCC32,.5X.6
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
3.55 mm
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.02 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn85Pb15)
Terminal Form
GULL WING
J BEND
Terminal Pitch
0.8 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
20
Width
7 mm
11.4554 mm
Base Number Matches
2
1
Compare 72V251L10PFG8 with alternatives
Compare IDT72V251L10J8 with alternatives