72V04L25J vs 72V04L25JG8 feature comparison

72V04L25J Integrated Device Technology Inc

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72V04L25JG8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PLCC QFJ
Package Description PLASTIC, LCC-32 QCCJ, LDCC32,.5X.6
Pin Count 32 32
Manufacturer Package Code PL32
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Total Weight 1104
Category CO2 Kg 12.3 12.3
CO2 13579.2
Compliance Temperature Grade Commercial: +0C to +70C Commercial: +0C to +70C
Candidate List Date 2024-01-23 2017-07-07
SVHC Over MCV 7439-92-1
CAS Accounted for Wt 87
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 7439-92-1, 1333-86-4
Conflict Mineral Status DRC Conflict Free DRC Conflict Free
Conflict Mineral Status Source CMRT V5.00 CMRT V6.01
Access Time-Max 25 ns 25 ns
Additional Feature RETRANSMIT
Clock Frequency-Max (fCLK) 28.5 MHz 28.5 MHz
Cycle Time 35 ns 35 ns
JESD-30 Code R-PQCC-J32 R-PQCC-J32
JESD-609 Code e0 e3
Length 13.9954 mm 13.995 mm
Memory Density 36864 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX9 4KX9
Output Enable NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC32,.5X.6 LDCC32,.5X.6
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.556 mm 3.556 mm
Standby Current-Max 0.0003 A 0.005 A
Supply Current-Max 0.05 mA 0.06 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 11.4554 mm 11.455 mm
Base Number Matches 1 1
EU RoHS Version RoHS 2 (2015/863/EU)
EFUP e
Output Characteristics 3-STATE

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