72V04L25JG8
vs
IDT72V04L25JGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFJ
QFJ
Package Description
QCCJ, LDCC32,.5X.6
QCCJ, LDCC32,.5X.6
Pin Count
32
32
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
25 ns
25 ns
Clock Frequency-Max (fCLK)
28.5 MHz
28.5 MHz
Cycle Time
35 ns
35 ns
JESD-30 Code
R-PQCC-J32
R-PQCC-J32
JESD-609 Code
e3
e3
Length
13.995 mm
13.97 mm
Memory Density
36864 bit
36864 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
9
9
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4KX9
4KX9
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC32,.5X.6
LDCC32,.5X.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.556 mm
3.55 mm
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.06 mA
0.06 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn) - annealed
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.455 mm
11.43 mm
Base Number Matches
1
1
Date Of Intro
1988-01-01
Additional Feature
RETRANSMIT
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare 72V04L25JG8 with alternatives
Compare IDT72V04L25JGI with alternatives