72821L25PFGI8 vs IDT72821L25PF9 feature comparison

72821L25PFGI8 Integrated Device Technology Inc

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IDT72821L25PF9 Integrated Device Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description TQFP-64 LQFP,
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 15 ns 15 ns
Cycle Time 25 ns 25 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
Length 14 mm 14 mm
Memory Density 18432 bit 9216 bit
Memory Width 9 9
Number of Functions 1 2
Number of Terminals 64 64
Number of Words 2048 words 1024 words
Number of Words Code 2000 1000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2KX9 1KX9
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 1.6 mm 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Part Package Code QFP
Pin Count 64
JESD-609 Code e0
Memory IC Type OTHER FIFO
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Supply Current-Max 0.08 mA
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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