72245LB25PFG8 vs IDT72245LB25PFI9 feature comparison

72245LB25PFG8 Integrated Device Technology Inc

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IDT72245LB25PFI9 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description , PLASTIC, TQFP-64
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 15 ns 40 ns
Cycle Time 25 ns 50 ns
JESD-30 Code R-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e0
Memory Density 73728 bit 4608 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 4096 words 4096 words
Number of Words Code 4000 512
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4KX18 512X9
Output Enable YES NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR SQUARE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Supply Current-Max 0.06 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Base Number Matches 2 1
Length 14 mm
Package Code LQFP
Package Style FLATPACK, LOW PROFILE
Seated Height-Max 1.6 mm
Terminal Pitch 0.8 mm
Width 14 mm

Compare 72245LB25PFG8 with alternatives

Compare IDT72245LB25PFI9 with alternatives