72245LB25PFG8 vs 72245LB25PFGI feature comparison

72245LB25PFG8 Integrated Device Technology Inc

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72245LB25PFGI Integrated Device Technology Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP QFP
Package Description , TQFP-64
Pin Count 64 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 15 ns 15 ns
Cycle Time 25 ns 25 ns
JESD-30 Code R-PQFP-G64 R-PQFP-G64
JESD-609 Code e3 e3
Memory Density 73728 bit 73728 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4KX18 4KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A 0.005 A
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) Matte Tin (Sn) - annealed
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Base Number Matches 1 1

Compare 72245LB25PFG8 with alternatives

Compare 72245LB25PFGI with alternatives