72241L25JG vs QS72241-25JR feature comparison

72241L25JG Integrated Device Technology Inc

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QS72241-25JR Quality Semiconductor Inc

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC QUALITY SEMICONDUCTOR INC
Part Package Code QFJ
Package Description LCC-32
Pin Count 32
Reach Compliance Code compliant unknown
Access Time-Max 15 ns 15 ns
Cycle Time 25 ns 25 ns
JESD-30 Code R-PLCC-J32 R-PQCC-J32
JESD-609 Code e3 e0
Memory Density 36864 bit 36864 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX9 4KX9
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.005 A 0.005 A
Supply Current-Max 0.035 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed TIN LEAD
Terminal Form J BEND J BEND
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 8 1
Clock Frequency-Max (fCLK) 40 MHz
Package Code QCCJ
Package Equivalence Code LDCC32,.5X.6
Package Style CHIP CARRIER
Qualification Status Not Qualified
Terminal Pitch 1.27 mm

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