72225LB15J8 vs 72V225L15TFGI8 feature comparison

72225LB15J8 Integrated Device Technology Inc

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72V225L15TFGI8 Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PLCC
Package Description PLASTIC, LCC-68 LFQFP,
Pin Count 68
Manufacturer Package Code PL68
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 10 ns 10 ns
Clock Frequency-Max (fCLK) 66.7 MHz
Cycle Time 15 ns 15 ns
JESD-30 Code S-PQCC-J68 S-PQFP-G64
JESD-609 Code e0
Length 24.2062 mm 10 mm
Memory Density 18432 bit 18432 bit
Memory IC Type OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 68 64
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1KX18 1KX18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ LFQFP
Package Equivalence Code LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified
Seated Height-Max 4.572 mm 1.6 mm
Standby Current-Max 0.005 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 3 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20 30
Width 24.2062 mm 10 mm
Base Number Matches 2 2

Compare 72225LB15J8 with alternatives

Compare 72V225L15TFGI8 with alternatives