72V225L15TFGI8
vs
IDT72225LB15TFI9
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
LFQFP,
|
PLASTIC, STQFP-64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
10 ns
|
50 ns
|
Cycle Time |
15 ns
|
65 ns
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
Length |
10 mm
|
10 mm
|
Memory Density |
18432 bit
|
9216 bit
|
Memory Width |
18
|
9
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
64
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
1KX18
|
1KX9
|
Output Enable |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
QFP
|
Pin Count |
|
64
|
JESD-609 Code |
|
e0
|
Memory IC Type |
|
OTHER FIFO
|
Moisture Sensitivity Level |
|
3
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
0.1 mA
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare 72V225L15TFGI8 with alternatives
Compare IDT72225LB15TFI9 with alternatives