72215LB15PFGI8
vs
72215LB15PF9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
TQFP
QFP
Package Description
TQFP-64
PLASTIC, TQFP-64
Pin Count
64
64
Manufacturer Package Code
PNG64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Date Of Intro
1992-01-01
Access Time-Max
10 ns
40 ns
Cycle Time
15 ns
50 ns
JESD-30 Code
R-PQFP-G64
S-PQFP-G64
JESD-609 Code
e3
e0
Memory Density
9216 bit
36864 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
18
9
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
512 words
512 words
Number of Words Code
512
4000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512X18
4KX9
Output Enable
YES
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
SQUARE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
Supply Current-Max
0.06 mA
0.15 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Base Number Matches
2
1
Length
14 mm
Package Code
LQFP
Package Style
FLATPACK, LOW PROFILE
Seated Height-Max
1.6 mm
Terminal Pitch
0.8 mm
Width
14 mm
Compare 72215LB15PFGI8 with alternatives
Compare 72215LB15PF9 with alternatives