72215LB15PF9 vs 72215LB15PF8 feature comparison

72215LB15PF9 Integrated Device Technology Inc

Buy Now Datasheet

72215LB15PF8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP TQFP
Package Description PLASTIC, TQFP-64 PLASTIC, TQFP-64
Pin Count 64 64
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 40 ns 10 ns
Cycle Time 50 ns 15 ns
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e0 e0
Length 14 mm 14 mm
Memory Density 36864 bit 9216 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 512 words 512 words
Number of Words Code 4000 512
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 4KX9 512X18
Output Enable NO YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Supply Current-Max 0.15 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 14 mm 14 mm
Base Number Matches 1 1
Manufacturer Package Code PN64
Clock Frequency-Max (fCLK) 66.7 MHz
Package Equivalence Code QFP64,.66SQ,32
Standby Current-Max 0.005 A

Compare 72215LB15PF9 with alternatives

Compare 72215LB15PF8 with alternatives