72211L10JG8 vs IDT72211L10JG feature comparison

72211L10JG8 Integrated Device Technology Inc

Buy Now Datasheet

IDT72211L10JG Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PLCC QFJ
Package Description LCC-32 QCCJ, LDCC32,.5X.6
Pin Count 32 32
Manufacturer Package Code PLG32
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 6.5 ns 6.5 ns
Cycle Time 10 ns 10 ns
JESD-30 Code R-PLCC-J32 R-PQCC-J32
JESD-609 Code e3 e3
Memory Density 4608 bit 4608 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 9 9
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512X9 512X9
Output Characteristics 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Standby Current-Max 0.005 A 0.005 A
Supply Current-Max 0.035 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
Terminal Form J BEND J BEND
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Base Number Matches 2 2
Date Of Intro 1992-01-01
Clock Frequency-Max (fCLK) 100 MHz
Length 13.97 mm
Package Code QCCJ
Package Equivalence Code LDCC32,.5X.6
Package Style CHIP CARRIER
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Terminal Pitch 1.27 mm
Width 11.43 mm

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