72205LB25JGI
vs
IDT72205LB25JGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
LCC
LCC
Package Description
,
QCCJ, LDCC68,1.0SQ
Pin Count
68
68
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15 ns
15 ns
Cycle Time
25 ns
25 ns
JESD-30 Code
R-PQCC-J68
S-PQCC-J68
JESD-609 Code
e3
e3
Memory Density
4608 bit
4608 bit
Memory IC Type
OTHER FIFO
OTHER FIFO
Memory Width
18
18
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
68
68
Number of Words
256 words
256 words
Number of Words Code
256
256
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256X18
256X18
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
0.005 A
Supply Current-Max
0.06 mA
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Matte Tin (Sn) - annealed
Matte Tin (Sn) - annealed
Terminal Form
J BEND
J BEND
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
40 MHz
Length
24.2062 mm
Package Equivalence Code
LDCC68,1.0SQ
Seated Height-Max
4.572 mm
Terminal Pitch
1.27 mm
Width
24.2062 mm
Compare 72205LB25JGI with alternatives
Compare IDT72205LB25JGI with alternatives