72205LB25JGI vs IDT72205LB25J8 feature comparison

72205LB25JGI Integrated Device Technology Inc

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IDT72205LB25J8 Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code LCC LCC
Package Description , PLASTIC, LCC-68
Pin Count 68 68
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 15 ns 15 ns
Cycle Time 25 ns 25 ns
JESD-30 Code R-PQCC-J68 S-PQCC-J68
JESD-609 Code e3 e0
Memory Density 4608 bit 4608 bit
Memory IC Type OTHER FIFO OTHER FIFO
Memory Width 18 18
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256X18 256X18
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape RECTANGULAR SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A 0.005 A
Supply Current-Max 0.06 mA 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) - annealed Tin/Lead (Sn85Pb15)
Terminal Form J BEND J BEND
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 20
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 40 MHz
Length 24.2062 mm
Output Characteristics 3-STATE
Package Equivalence Code LDCC68,1.0SQ
Seated Height-Max 4.572 mm
Terminal Pitch 1.27 mm
Width 24.2062 mm

Compare 72205LB25JGI with alternatives

Compare IDT72205LB25J8 with alternatives