71V432S8PF vs GS81032AGQ-4T feature comparison

71V432S8PF Integrated Device Technology Inc

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GS81032AGQ-4T GSI Technology

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC GSI TECHNOLOGY
Part Package Code QFP QFP
Package Description PLASTIC, TQFP-100 QFP,
Pin Count 100 100
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.B.2.B 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 8 ns 11 ns
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0
Length 20 mm 20 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 32 32
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Terminals 100 100
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX32 32KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QFP
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 3.35 mm
Supply Voltage-Max (Vsup) 3.63 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD PURE MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm 14 mm
Base Number Matches 9 1
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE

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Compare GS81032AGQ-4T with alternatives