GS81032AGQ-4T
vs
MT58LC64K18C4LG-7TR
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
GSI TECHNOLOGY
|
MICRON TECHNOLOGY INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP,
|
LQFP,
|
Pin Count |
100
|
100
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.B
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
11 ns
|
|
Additional Feature |
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
AUTOMATIC POWER-DOWN
|
JESD-30 Code |
R-PQFP-G100
|
R-PQFP-G100
|
Length |
20 mm
|
20 mm
|
Memory Density |
1048576 bit
|
1179648 bit
|
Memory IC Type |
CACHE SRAM
|
STANDARD SRAM
|
Memory Width |
32
|
18
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Number of Words |
32768 words
|
65536 words
|
Number of Words Code |
32000
|
64000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
32KX32
|
64KX18
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
LQFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.35 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
PURE MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e0
|
Number of Ports |
|
1
|
Output Characteristics |
|
3-STATE
|
Output Enable |
|
YES
|
|
|
|
Compare GS81032AGQ-4T with alternatives
Compare MT58LC64K18C4LG-7TR with alternatives