71V416YFS10BEI
vs
71V416S10BEGI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
RENESAS ELECTRONICS CORP
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B48
S-PBGA-B48
JESD-609 Code
e0
e1
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
4
3
Number of Terminals
48
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX16
256KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Equivalence Code
BGA48,6X8,30
BGA48,6X8,30
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
260
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.02 A
0.02 A
Standby Voltage-Min
3 V
3 V
Supply Current-Max
0.2 mA
0.2 mA
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Base Number Matches
1
2
Package Description
9 X 9 MM, ROHS COMPLIANT, BGA-48
Length
9 mm
Number of Functions
1
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Width
9 mm
Compare 71V416YFS10BEI with alternatives
Compare 71V416S10BEGI with alternatives