71V416VS10BEGI
vs
71V416YFS10BEI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
Package Description
9 X 9 MM, ROHS COMPLIANT, BGA-48
Pin Count
48
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
10 ns
10 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B48
R-PBGA-B48
JESD-609 Code
e1
e0
Length
9 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
4
Number of Functions
1
Number of Terminals
48
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX16
256KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA48,6X8,30
BGA48,6X8,30
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Standby Current-Max
0.02 A
0.02 A
Standby Voltage-Min
3 V
3 V
Supply Current-Max
0.2 mA
0.2 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
30
Width
9 mm
Base Number Matches
1
1
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Compare 71V416YFS10BEI with alternatives