71V3576YS150BGGI
vs
IS61VF12836A-7.5B3I
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
SEIKO INSTRUMENTS USA INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA,
|
TBGA,
|
Pin Count |
119
|
165
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.B.2.A
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
3.8 ns
|
7.5 ns
|
Additional Feature |
PIPELINED ARCHITECTURE
|
PIPELINED/FLOW-THROUGH ARCHITECTURE, ALSO OPERATES WITH 3.135V TO 3.465V SUPPLY
|
JESD-30 Code |
R-PBGA-B119
|
R-PBGA-B165
|
JESD-609 Code |
e1
|
|
Length |
22 mm
|
15 mm
|
Memory Density |
4718592 bit
|
4718592 bit
|
Memory IC Type |
CACHE SRAM
|
CACHE SRAM
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
119
|
165
|
Number of Words |
131072 words
|
131072 words
|
Number of Words Code |
128000
|
128000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
128KX36
|
128KX36
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
TBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.36 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.465 V
|
3.465 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
3.135 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
14 mm
|
13 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare 71V3576YS150BGGI with alternatives
Compare IS61VF12836A-7.5B3I with alternatives