71V3576YS150BGGI vs IS61VF12836A-7.5B3I feature comparison

71V3576YS150BGGI Integrated Device Technology Inc

Buy Now Datasheet

IS61VF12836A-7.5B3I ABLIC Inc.

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC SEIKO INSTRUMENTS USA INC
Part Package Code BGA BGA
Package Description BGA, TBGA,
Pin Count 119 165
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 3.8 ns 7.5 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED/FLOW-THROUGH ARCHITECTURE, ALSO OPERATES WITH 3.135V TO 3.465V SUPPLY
JESD-30 Code R-PBGA-B119 R-PBGA-B165
JESD-609 Code e1
Length 22 mm 15 mm
Memory Density 4718592 bit 4718592 bit
Memory IC Type CACHE SRAM CACHE SRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 165
Number of Words 131072 words 131072 words
Number of Words Code 128000 128000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 128KX36 128KX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.36 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 14 mm 13 mm
Base Number Matches 1 2

Compare 71V3576YS150BGGI with alternatives

Compare IS61VF12836A-7.5B3I with alternatives