7188L25DB
vs
IDT7188S30P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CDIP
DIP
Package Description
DIP, DIP22,.3
DIP, DIP22,.3
Pin Count
22
22
Manufacturer Package Code
CD22
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
30 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDIP-T22
R-PDIP-T22
JESD-609 Code
e0
e0
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
22
22
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
16KX4
16KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP22,.3
DIP22,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Standby Current-Max
0.0006 A
0.015 A
Standby Voltage-Min
2 V
4.5 V
Supply Current-Max
0.12 mA
0.125 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Length
26.797 mm
Number of Ports
1
Output Enable
NO
Seated Height-Max
4.191 mm
Width
7.62 mm
Compare 7188L25DB with alternatives
Compare IDT7188S30P with alternatives