7164L25TPGI vs 7164S25TDGB8 feature comparison

7164L25TPGI Renesas Electronics Corporation

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7164S25TDGB8 Integrated Device Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP INTEGRATED DEVICE TECHNOLOGY INC
Package Description DIP-28 DIP,
Reach Compliance Code compliant compliant
Access Time-Max 25 ns 25 ns
JESD-30 Code R-PDIP-T28 R-CDIP-T28
JESD-609 Code e3 e3
Length 34.671 mm 37.1475 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8KX8 8KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Seated Height-Max 4.572 mm 5.08 mm
Supply Current-Max 0.3 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish MATTE TIN Matte Tin (Sn)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code DIP
Pin Count 28
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.41
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Screening Level MIL-STD-883 Class B
Time@Peak Reflow Temperature-Max (s) 30

Compare 7164L25TPGI with alternatives

Compare 7164S25TDGB8 with alternatives