7130LA25LGI8
vs
IDT71V30L25TF9
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
QCCN,
|
STQFP-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
25 ns
|
25 ns
|
| JESD-30 Code |
S-XQCC-N48
|
S-PQFP-G64
|
| Memory Density |
8192 bit
|
8192 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
64
|
| Number of Words |
1024 words
|
1024 words
|
| Number of Words Code |
1000
|
1000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
1KX8
|
1KX8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
64
|
| Additional Feature |
|
BATTERY BACKUP OPERATION
|
| JESD-609 Code |
|
e0
|
| Length |
|
10 mm
|
| Moisture Sensitivity Level |
|
3
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.6 mm
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Width |
|
10 mm
|
|
|
|
Compare 7130LA25LGI8 with alternatives
Compare IDT71V30L25TF9 with alternatives