70V9269S9PRFI
vs
IDT70V9269L9PRFG8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
14 X 20 MM, 1.40 MM HEIGHT, TQFP-128
LFQFP,
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
9 ns
20 ns
Clock Frequency-Max (fCLK)
66 MHz
I/O Type
COMMON
JESD-30 Code
R-PQFP-G128
R-PQFP-G128
JESD-609 Code
e0
e3
Memory Density
262144 bit
262144 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
128
128
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
16KX16
16KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LFQFP
Package Equivalence Code
QFP128,.63X.87,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.005 A
Standby Voltage-Min
3 V
Supply Current-Max
0.27 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Matte Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Base Number Matches
1
1
Part Package Code
QFP
Pin Count
128
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Length
20 mm
Seated Height-Max
1.6 mm
Width
14 mm
Compare 70V9269S9PRFI with alternatives
Compare IDT70V9269L9PRFG8 with alternatives