70V9269L12PRFGI8
vs
IDT709269S12GI
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TQFP
|
PGA
|
| Pin Count |
128
|
108
|
| Manufacturer Package Code |
PKG128
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
NLR
|
EAR99
|
| HTS Code |
8542320041
|
8542.32.00.41
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| JESD-609 Code |
e3
|
e3
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Moisture Sensitivity Level |
3
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
PGA,
|
| Access Time-Max |
|
25 ns
|
| Additional Feature |
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
| JESD-30 Code |
|
S-CPGA-P108
|
| Length |
|
30.48 mm
|
| Memory Density |
|
262144 bit
|
| Memory Width |
|
16
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
108
|
| Number of Words |
|
16384 words
|
| Number of Words Code |
|
16000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
16KX16
|
| Package Body Material |
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
|
PGA
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
5.207 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
NO
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
PIN/PEG
|
| Terminal Pitch |
|
2.54 mm
|
| Terminal Position |
|
PERPENDICULAR
|
| Width |
|
30.48 mm
|
|
|
|
Compare 70V9269L12PRFGI8 with alternatives
Compare IDT709269S12GI with alternatives