70V914S15PF
vs
70914S15JI8
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
TQFP
|
PLCC
|
| Package Description |
,
|
PLASTIC, LCC-68
|
| Pin Count |
80
|
68
|
| Manufacturer Package Code |
PN80
|
PL68
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| JESD-609 Code |
e0
|
e0
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Moisture Sensitivity Level |
3
|
1
|
| Peak Reflow Temperature (Cel) |
240
|
225
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Base Number Matches |
3
|
2
|
| Access Time-Max |
|
15 ns
|
| I/O Type |
|
COMMON
|
| JESD-30 Code |
|
S-PQCC-J68
|
| Length |
|
24.2062 mm
|
| Memory Density |
|
36864 bit
|
| Memory Width |
|
9
|
| Number of Functions |
|
1
|
| Number of Ports |
|
2
|
| Number of Terminals |
|
68
|
| Number of Words |
|
4096 words
|
| Number of Words Code |
|
4000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
4KX9
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
QCCJ
|
| Package Equivalence Code |
|
LDCC68,1.0SQ
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
4.572 mm
|
| Standby Voltage-Min |
|
4.5 V
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
J BEND
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
| Width |
|
24.2062 mm
|
|
|
|
Compare 70V914S15PF with alternatives
Compare 70914S15JI8 with alternatives