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70V7339S133BF8 vs IDT70T633S8BF feature comparison

70V7339S133BF8 Integrated Device Technology Inc

Buy Now Datasheet

IDT70T633S8BF Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA BGA
Package Description 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208
Pin Count 208 208
Manufacturer Package Code BF208
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 8 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e0 e0
Length 15 mm 15 mm
Memory Density 9437184 bit 9437184 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 208 208
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX18 512KX18
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA208,17X17,32 BGA208,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.5 mm
Standby Current-Max 0.03 A 0.01 A
Standby Voltage-Min 3.15 V 2.4 V
Supply Current-Max 0.645 mA 0.475 mA
Supply Voltage-Max (Vsup) 3.45 V 2.6 V
Supply Voltage-Min (Vsup) 3.15 V 2.4 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20 20
Width 15 mm 15 mm
Base Number Matches 2 4
Memory » SRAMs
Memory » SRAMs

Compare 70V7339S133BF8 with alternatives

Compare IDT70T633S8BF with alternatives