We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

70V657S15DRGI vs IDT70V657S15BC feature comparison

70V657S15DRGI Integrated Device Technology Inc

Buy Now Datasheet

IDT70V657S15BC Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code QFP BGA
Package Description FQFP, QFP208,1.2SQ,20 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
Pin Count 208 256
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
I/O Type COMMON COMMON
JESD-30 Code S-PQFP-G208 S-PBGA-B256
JESD-609 Code e3 e0
Length 28 mm 17 mm
Memory Density 1179648 bit 1179648 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 208 256
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 32KX36 32KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP LBGA
Package Equivalence Code QFP208,1.2SQ,20 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 1.5 mm
Standby Current-Max 0.015 A 0.015 A
Standby Voltage-Min 3.15 V 3.15 V
Supply Current-Max 0.49 mA 0.44 mA
Supply Voltage-Max (Vsup) 3.45 V 3.45 V
Supply Voltage-Min (Vsup) 3.15 V 3.15 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn63Pb37)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 20
Width 28 mm 17 mm
Base Number Matches 3 6
Memory » SRAMs
Memory » SRAMs

Compare 70V657S15DRGI with alternatives

Compare IDT70V657S15BC with alternatives