70V639S15BCI
vs
IDT70V639S15BCI8
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Memory Density
2359296 bit
2359296 bit
Memory IC Type
APPLICATION SPECIFIC SRAM
APPLICATION SPECIFIC SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
Number of Functions
1
Number of Ports
2
2
Number of Terminals
256
256
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX18
128KX18
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.015 A
0.03 A
Standby Voltage-Min
3.15 V
3.15 V
Supply Current-Max
0.49 mA
0.49 mA
Supply Voltage-Max (Vsup)
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Base Number Matches
1
1
Compare 70V639S15BCI with alternatives
Compare IDT70V639S15BCI8 with alternatives