70V639S15BCI
vs
IDT70V639S15BCG
feature comparison
All Stats
Differences Only
Pbfree Code
No
Yes
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, GREEN, BGA-256
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
I/O Type
COMMON
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Memory Density
2359296 bit
2359296 bit
Memory IC Type
APPLICATION SPECIFIC SRAM
MULTI-PORT SRAM
Memory Width
18
18
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Ports
2
Number of Terminals
256
256
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128KX18
128KX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
225
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.015 A
Standby Voltage-Min
3.15 V
Supply Current-Max
0.49 mA
Supply Voltage-Max (Vsup)
3.45 V
3.45 V
Supply Voltage-Min (Vsup)
3.15 V
3.15 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn63Pb37)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
256
Length
17 mm
Seated Height-Max
1.7 mm
Width
17 mm
Compare 70V639S15BCI with alternatives
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