70V631S15PRFI
vs
IDT70V631S15PRFG8
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| JESD-609 Code |
e0
|
e3
|
| Moisture Sensitivity Level |
3
|
3
|
| Peak Reflow Temperature (Cel) |
225
|
NOT SPECIFIED
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
QFP
|
| Package Description |
|
LFQFP,
|
| Pin Count |
|
128
|
| Access Time-Max |
|
15 ns
|
| JESD-30 Code |
|
R-PQFP-G128
|
| Length |
|
20 mm
|
| Memory Density |
|
4718592 bit
|
| Memory IC Type |
|
MULTI-PORT SRAM
|
| Memory Width |
|
18
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
128
|
| Number of Words |
|
262144 words
|
| Number of Words Code |
|
256000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
256KX18
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFQFP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
14 mm
|
|
|
|
Compare 70V631S15PRFI with alternatives
Compare IDT70V631S15PRFG8 with alternatives