70V631S15PRFG8
vs
70T631S15BC8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Package Description
QFP,
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
JESD-30 Code
R-PQFP-G128
S-PBGA-B256
Memory Density
4718592 bit
4718592 bit
Memory IC Type
DUAL-PORT SRAM
MULTI-PORT SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
128
256
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX18
256KX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LBGA
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
225
Supply Voltage-Max (Vsup)
3.45 V
2.6 V
Supply Voltage-Min (Vsup)
3.15 V
2.4 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Position
QUAD
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Base Number Matches
1
2
Pbfree Code
Part Package Code
CABGA
Pin Count
256
Manufacturer Package Code
BC256
I/O Type
COMMON
JESD-609 Code
e0
Length
17 mm
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
BGA256,16X16,40
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.305 mA
Terminal Finish
TIN LEAD
Terminal Pitch
1 mm
Width
17 mm
Compare 70V631S15PRFG8 with alternatives
Compare 70T631S15BC8 with alternatives