70V25S20PFGI8
vs
7025S20PFGI
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Package Description |
QFP,
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
20 ns
|
70 ns
|
| JESD-30 Code |
S-PQFP-G100
|
|
| Memory Density |
131072 bit
|
|
| Memory IC Type |
DUAL-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
16
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
100
|
|
| Number of Words |
8192 words
|
|
| Number of Words Code |
8000
|
|
| Operating Mode |
ASYNCHRONOUS
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
8KX16
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QFP
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK
|
|
| Parallel/Serial |
PARALLEL
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
1
|
| Date Of Intro |
|
2018-01-26
|
|
|
|
Compare 70V25S20PFGI8 with alternatives
Compare 7025S20PFGI with alternatives