70T9169S12BFI
vs
IDT70T9169L12BF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
CABGA
BGA
Package Description
,
LFBGA, BGA100,10X10,32
Pin Count
100
100
Manufacturer Package Code
BF100
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
JESD-609 Code
e0
e0
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Moisture Sensitivity Level
3
3
Peak Reflow Temperature (Cel)
225
240
Terminal Finish
TIN LEAD
Tin/Lead (Sn63Pb37)
Base Number Matches
1
1
Access Time-Max
25 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK)
50 MHz
I/O Type
COMMON
JESD-30 Code
S-PBGA-B100
Length
10 mm
Memory Density
147456 bit
Memory Width
9
Number of Functions
1
Number of Ports
2
Number of Terminals
100
Number of Words
16384 words
Number of Words Code
16000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
16KX9
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
LFBGA
Package Equivalence Code
BGA100,10X10,32
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
1.5 mm
Standby Current-Max
0.003 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.15 mA
Supply Voltage-Max (Vsup)
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
10 mm
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Compare IDT70T9169L12BF with alternatives