We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

70T633S12BFI vs AS9C25256M2018L-133FI feature comparison

70T633S12BFI Integrated Device Technology Inc

Buy Now Datasheet

AS9C25256M2018L-133FI Alliance Semiconductor Corporation

Buy Now Datasheet
Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC ALLIANCE SEMICONDUCTOR CORP
Part Package Code CABGA BGA
Package Description 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208 LFBGA,
Pin Count 208 208
Manufacturer Package Code BF208
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 12 ns 12 ns
I/O Type COMMON
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e0 e0
Length 15 mm 15 mm
Memory Density 9437184 bit 4718592 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 18 18
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Ports 2
Number of Terminals 208 208
Number of Words 524288 words 262144 words
Number of Words Code 512000 256000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX18 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA208,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.4 mm
Standby Current-Max 0.02 A
Standby Voltage-Min 2.4 V
Supply Current-Max 0.395 mA
Supply Voltage-Max (Vsup) 2.6 V 2.6 V
Supply Voltage-Min (Vsup) 2.4 V 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 15 mm 15 mm
Base Number Matches 4 1
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Memory » SRAMs
Memory » SRAMs

Compare 70T633S12BFI with alternatives

Compare AS9C25256M2018L-133FI with alternatives