AS9C25256M2018L-133FI
vs
70T631S8BF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTEGRATED SILICON SOLUTION INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
LFBGA,
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208
Pin Count
208
208
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
12 ns
8 ns
Additional Feature
FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code
S-PBGA-B208
S-PBGA-B208
JESD-609 Code
e0
e0
Length
15 mm
15 mm
Memory Density
4718592 bit
4718592 bit
Memory IC Type
MULTI-PORT SRAM
MULTI-PORT SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
208
208
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
256KX18
256KX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.5 mm
Supply Voltage-Max (Vsup)
2.6 V
2.6 V
Supply Voltage-Min (Vsup)
2.4 V
2.4 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn63Pb37)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
15 mm
Base Number Matches
2
1
I/O Type
COMMON
Moisture Sensitivity Level
3
Number of Ports
2
Output Characteristics
3-STATE
Package Equivalence Code
BGA208,17X17,32
Peak Reflow Temperature (Cel)
225
Standby Current-Max
0.01 A
Standby Voltage-Min
2.4 V
Supply Current-Max
0.475 mA
Time@Peak Reflow Temperature-Max (s)
20
Compare AS9C25256M2018L-133FI with alternatives
Compare 70T631S8BF with alternatives