70T633S12BFGI8
vs
70V7339S133BF8
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
CABGA
|
CABGA
|
| Pin Count |
208
|
208
|
| Manufacturer Package Code |
BFG208
|
BF208
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
NLR
|
3A991.B.2.A
|
| HTS Code |
8542320041
|
8542.32.00.41
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| Access Time-Max |
12 ns
|
15 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
S-PBGA-B208
|
S-PBGA-B208
|
| JESD-609 Code |
e1
|
e0
|
| Memory Density |
9437184 bit
|
9437184 bit
|
| Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
| Memory Width |
18
|
18
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
208
|
208
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512KX18
|
512KX18
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFBGA
|
| Package Equivalence Code |
BGA208,17X17,32
|
BGA208,17X17,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.02 A
|
0.03 A
|
| Standby Voltage-Min |
2.4 V
|
3.15 V
|
| Supply Current-Max |
0.395 mA
|
0.645 mA
|
| Supply Voltage-Max (Vsup) |
2.6 V
|
3.45 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
3.15 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
| Base Number Matches |
1
|
2
|
| Package Description |
|
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FBGA-208
|
| Additional Feature |
|
FLOW-THROUGH OR PIPELINED ARCHITECTURE
|
| Clock Frequency-Max (fCLK) |
|
133 MHz
|
| Length |
|
15 mm
|
| Seated Height-Max |
|
1.2 mm
|
| Width |
|
15 mm
|
|
|
|
Compare 70T633S12BFGI8 with alternatives
Compare 70V7339S133BF8 with alternatives