70T3519S133BFGI
vs
IDT70T3519S133BFGI8
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Part Package Code |
CABGA
|
|
Package Description |
15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FPBGA-208
|
FBGA, BGA208,17X17,32
|
Pin Count |
208
|
|
Manufacturer Package Code |
BFG208
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
15 ns
|
15 ns
|
Additional Feature |
PIPELINED OR FLOW-THROUGH ARCHITECTURE
|
|
Clock Frequency-Max (fCLK) |
133 MHz
|
133 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PBGA-B208
|
S-PBGA-B208
|
JESD-609 Code |
e1
|
e1
|
Length |
15 mm
|
|
Memory Density |
9437184 bit
|
9437184 bit
|
Memory IC Type |
MULTI-PORT SRAM
|
MULTI-PORT SRAM
|
Memory Width |
36
|
36
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
|
Number of Ports |
2
|
2
|
Number of Terminals |
208
|
208
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
256KX36
|
256KX36
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
FBGA
|
Package Equivalence Code |
BGA208,17X17,32
|
BGA208,17X17,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY, FINE PITCH
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7 mm
|
|
Standby Current-Max |
0.02 A
|
0.015 A
|
Standby Voltage-Min |
2.4 V
|
2.4 V
|
Supply Current-Max |
0.45 mA
|
0.45 mA
|
Supply Voltage-Max (Vsup) |
2.6 V
|
|
Supply Voltage-Min (Vsup) |
2.4 V
|
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
15 mm
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare 70T3519S133BFGI with alternatives
Compare IDT70T3519S133BFGI8 with alternatives