We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

IDT70T3519S133BFGI8 vs 70T3519S133BF feature comparison

IDT70T3519S133BFGI8 Integrated Device Technology Inc

Buy Now Datasheet

70T3519S133BF Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description FBGA, BGA208,17X17,32 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
Clock Frequency-Max (fCLK) 133 MHz 133 MHz
I/O Type COMMON COMMON
JESD-30 Code S-PBGA-B208 S-PBGA-B208
JESD-609 Code e1 e0
Memory Density 9437184 bit 9437184 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3 3
Number of Ports 2 2
Number of Terminals 208 208
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX36 256KX36
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA TFBGA
Package Equivalence Code BGA208,17X17,32 BGA208,17X17,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.015 A 0.015 A
Standby Voltage-Min 2.4 V 2.4 V
Supply Current-Max 0.45 mA 0.37 mA
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Base Number Matches 1 2
Part Package Code CABGA
Pin Count 208
Manufacturer Package Code BF208
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
Length 15 mm
Number of Functions 1
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 2.6 V
Supply Voltage-Min (Vsup) 2.4 V
Supply Voltage-Nom (Vsup) 2.5 V
Width 15 mm
Memory » SRAMs
Memory » SRAMs

Compare IDT70T3519S133BFGI8 with alternatives

Compare 70T3519S133BF with alternatives