70T06L20BF vs IDT7006L20GGI feature comparison

70T06L20BF Integrated Device Technology Inc

Buy Now Datasheet

IDT7006L20GGI Integrated Device Technology Inc

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code CABGA PGA
Package Description LFBGA, PGA,
Pin Count 100 68
Manufacturer Package Code BF100
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
Additional Feature FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code S-PBGA-B100 S-CPGA-P68
JESD-609 Code e0 e3
Length 10 mm 27.889 mm
Memory Density 131072 bit 131072 bit
Memory IC Type MULTI-PORT SRAM MULTI-PORT SRAM
Memory Width 8 8
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 100 68
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 16KX8 16KX8
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code LFBGA PGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 2.413 mm
Supply Voltage-Max (Vsup) 2.6 V 5.5 V
Supply Voltage-Min (Vsup) 2.4 V 4.5 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form BALL PIN/PEG
Terminal Pitch 0.8 mm 2.54 mm
Terminal Position BOTTOM PERPENDICULAR
Width 10 mm 27.889 mm
Base Number Matches 2 1

Compare 70T06L20BF with alternatives

Compare IDT7006L20GGI with alternatives