70825S20GI vs IDT70825L20PFI feature comparison

70825S20GI Integrated Device Technology Inc

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IDT70825L20PFI Integrated Device Technology Inc

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code not_compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 20 ns 20 ns
JESD-30 Code S-PPGA-P84 S-PQFP-G80
JESD-609 Code e0 e0
Memory Density 131072 bit 131072 bit
Memory IC Type APPLICATION SPECIFIC SRAM STANDARD SRAM
Memory Width 16 16
Number of Terminals 84 80
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code PGA LQFP
Package Equivalence Code PGA84M,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.015 A
Supply Current-Max 0.38 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form PIN/PEG GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position PERPENDICULAR QUAD
Base Number Matches 1 2
Part Package Code QFP
Package Description TQFP-80
Pin Count 80
Length 14 mm
Moisture Sensitivity Level 3
Number of Functions 1
Operating Mode ASYNCHRONOUS
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 240
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm

Compare 70825S20GI with alternatives

Compare IDT70825L20PFI with alternatives