70825L25PFI vs IDT70825L45PFBG feature comparison

70825L25PFI Integrated Device Technology Inc

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IDT70825L45PFBG Integrated Device Technology Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TQFP QFP
Package Description QFP, QFP80,.64SQ TQFP-80
Pin Count 80 80
Manufacturer Package Code PN80
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 45 ns
JESD-30 Code S-PQFP-G80 S-PQFP-G80
JESD-609 Code e0 e3
Memory Density 131072 bit 131072 bit
Memory IC Type APPLICATION SPECIFIC SRAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 3
Number of Terminals 80 80
Number of Words 8192 words 8192 words
Number of Words Code 8000 8000
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 8KX16 8KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LQFP
Package Equivalence Code QFP80,.64SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.005 A
Supply Current-Max 0.31 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish TIN LEAD MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.635 mm 0.65 mm
Terminal Position QUAD QUAD
Base Number Matches 3 1
Length 14 mm
Number of Functions 1
Operating Mode ASYNCHRONOUS
Parallel/Serial PARALLEL
Seated Height-Max 1.6 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 14 mm

Compare 70825L25PFI with alternatives

Compare IDT70825L45PFBG with alternatives